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Patent Searching and Data


Title:
EXPANDED POLYSTYRENE-BASED RESIN MOLDED ARTICLE HAVING CURED SURFACE LAYER AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2005154691
Kind Code:
A
Abstract:

To provide an expanded polystyrene-based resin molded article having a surface of an improved mechanical strength and penetration resistance, and a method for producing the same.

The expanded polystyrene-based resin molded article has a cured surface layer that is made by curing of a polymerizable resin composition composed of a component (A) and/or component (B), wherein, (A) is a polymerizable acrylate and/or methacrylate and (B) is a polymerizable oligomer, and the polymerizable resin composition may also contain a polymerization initiator (C). The surface property of the expanded polystyrene-based resin molded article is improved by curing the polymerizable resin composition coated on the surface of the expanded polystyrene-based resin molded article.


Inventors:
HONDA TERUMASA
WATANABE YOSHIO
KATO MITSUHARU
Application Number:
JP2003399225A
Publication Date:
June 16, 2005
Filing Date:
November 28, 2003
Export Citation:
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Assignee:
NIKKA KASEIHIN KK
SAITO SUSUMU
International Classes:
B65G67/00; A61G17/007; C08J9/36; (IPC1-7): C08J9/36
Attorney, Agent or Firm:
Kihei Watanabe