Title:
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JP2023162897
Kind Code:
A
Abstract:
To provide an expanding device, a semiconductor chip manufacturing method, and a semiconductor chip that allow a sheet member to expand smoothly on an expand ring when expanding the sheet member.SOLUTION: An expanding device 100 includes an expand ring 208 that divides a wafer W1 along a dividing line by expanding a sheet member W2 with a ring-shaped member W3 being gripped by a clamp portion 214. The expand ring 208 includes a sphere 281b rotatably arranged at a portion that contacts the sheet member W2 during expansion, and a housing space 281a that rotatably accommodates the sphere 281b.SELECTED DRAWING: Figure 14
Inventors:
SUZUKI YOSHIKUNI
Application Number:
JP2022073605A
Publication Date:
November 09, 2023
Filing Date:
April 27, 2022
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD
International Classes:
H01L21/301; B23K26/53; H01L21/677
Attorney, Agent or Firm:
Hirokazu Miyazono