Title:
EXPOSURE PATTERN AND METHOD FOR INSPECTING EXPOSURE ORIGINAL PLATE
Document Type and Number:
Japanese Patent JP2001174977
Kind Code:
A
Abstract:
To avert the failure in inspection by the frequent occurrence of errors at double exposure points in photomask inspection.
When a negative resist is used for the photomask by considering double exposure for the wiring of the region where two mask patterns of exposure original plate formed with ≥2 mask patterns in exposure, the wiring parts ANDed of the two mask patterns are subjected to broadening processing to attain a specified broadening quantity. When a position resist is used for the photomask, the wiring parts where the two mask patterns are superposed are subjected to narrowing processing to attain a specified narrowing quantity. The inspection is carried out by reflecting such wiring parts in the data for inspection.
Inventors:
MIYAGAWA SEIJI
Application Number:
JP36106999A
Publication Date:
June 29, 2001
Filing Date:
December 20, 1999
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/027; G03F1/84; G03F7/20; H01L21/66; (IPC1-7): G03F1/08; H01L21/027
Attorney, Agent or Firm:
Yoshiyuki Iwasa