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Title:
EXPOSURE PROCESSING METHOD FOR FILM BODY AND METHOD OF MAKING MICRODEVICE ELEMENT
Document Type and Number:
Japanese Patent JP2002116554
Kind Code:
A
Abstract:

To provide a method which is adequately usable for a device, such as a stepper, and is used to implement exact exposure alignment processing without depending upon the kinds of substrates.

A substrate formed with a film body is installed on the main surface of a substrate holding member held at a prescribed temperature and is then held for ≥30 seconds. The film body is subjected to the exposure processing.


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Inventors:
UEJIMA SATOSHI
YAMAZAKI RYUICHI
Application Number:
JP2000305670A
Publication Date:
April 19, 2002
Filing Date:
October 05, 2000
Export Citation:
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Assignee:
TDK CORP
International Classes:
G03F7/20; G03F9/00; G11B5/31; (IPC1-7): G03F7/20; G03F9/00; G11B5/31
Attorney, Agent or Firm:
Sugimura Kosaku (1 person outside)



 
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