To provide an exposure system capable of enhancing processing capac ity and reducing processing cost.

A UV absorbing region is formed in a central region of an exposure stage 21 and a UV reflecting region 23 is formed around the UV absorbing region. The UV absorbing region is situated under the pattern forming region 13 of a glass substrate 12 and the UV reflecting region 23 is situated under the pattern formation needless region 14 of the glass substrate 12. Ultraviolet rays R are projected from a mercury lamp. The UV absorbing region absorbs the UV rays R and the UV reflection region 23 reflects the UV rays R. The pattern formation needless region 14 can be exposed more than the pattern forming region 13. An unnecessary photoresist can be dissolved and removed only by a single exposure step. Processing capacity can be enhanced and the processing cost of the glass substrate 12 can be reduced.