Title:
EXPOXY RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS63161017
Kind Code:
A
Abstract:
Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C1 to C4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.
Inventors:
UORUFUGANGU KUREEBERUKU
HAINTSU HATSUKAA
YURUGEN FUUBAA
DEIITAA UIRUHERUMU
HAINTSU KURAUSU RAUPENMIYUUREN
HAINTSU HATSUKAA
YURUGEN FUUBAA
DEIITAA UIRUHERUMU
HAINTSU KURAUSU RAUPENMIYUUREN
Application Number:
JP31394787A
Publication Date:
July 04, 1988
Filing Date:
December 11, 1987
Export Citation:
Assignee:
SIEMENS AG
International Classes:
C07D251/34; C08G59/00; C08G59/18; C08G59/40; C08G59/50; C08K3/36; C08K7/02; C08L63/00; H01B3/40; H01L23/29; H01L23/31; (IPC1-7): C08G59/18; C08G59/50; C08K7/02; C08L63/00; H01L23/30
Attorney, Agent or Firm:
Tomimura Kiyoshi
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