Title:
マシン型通信のための拡張された送信時間間隔バンドリング設計
Document Type and Number:
Japanese Patent JP6808703
Kind Code:
B2
Abstract:
Aspects of the present disclosure provide techniques for enhanced transmission time interval (TTI) bundling design for machine type communications (MTC). A method for wireless communications by a wireless device is provided. The method generally includes determining a mapping of one or more uplink or downlink channels to one or more fixed bundling sizes, wherein each of the one or more fixed bundling sizes indicates a number of transmission time intervals (TTIs) over which a channel should be transmitted and processing transmission of the one or more uplink or downlink channels based on the mapping.
Inventors:
Hao Shu
Wanshi Chen
Ting Huang Ji
Peter girl
Wanshi Chen
Ting Huang Ji
Peter girl
Application Number:
JP2018219345A
Publication Date:
January 06, 2021
Filing Date:
November 22, 2018
Export Citation:
Assignee:
QUALCOMM INCORPORATED
International Classes:
H04W28/04; H04W4/70; H04W72/04
Domestic Patent References:
| JP2012530434A |
Other References:
Qualcomm Incorporated,Coverage enhancement techniques for MTC[online],3GPP TSG-RAN WG1#72 R1-130589,2013年 1月19日,[検索日2020.02.27], インターネット
Attorney, Agent or Firm:
Kurata Masatoshi
Yoshihiro Fukuhara
Morisezo Iseki
Takashi Okada
Nakamaru Yoshihiro
Yoshihiro Fukuhara
Morisezo Iseki
Takashi Okada
Nakamaru Yoshihiro