Title:
EXTRA-FINE PLATED WIRE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005349467
Kind Code:
A
Abstract:
To provide an extra-fine plated wire manufacturing method capable of efficiently manufacturing an extra-fine plated wire by suppressing generation of metal powder attributable to a plating layer.
In the extra-fine plated wire manufacturing method in which a plated copper or copper alloy wire is drawn by a die 10, the wire is drawn before the wire diameter reaches ≤ 0.05 mm by setting the die bearing pressure which is the drawing force divided by the contact area of the wire with an inner face of the die to be ≤ 1.47 × 102MPa, the die angle (2α) to be 6-10°, and the reduction rate of area to be 5-15%, respectively.
Inventors:
YAMADA TSUYOSHI
MIMURA SHOJI
SAITO TAKASHI
MIMURA SHOJI
SAITO TAKASHI
Application Number:
JP2004176228A
Publication Date:
December 22, 2005
Filing Date:
June 14, 2004
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
B21C1/00; B21C3/02; C25D7/06; (IPC1-7): B21C1/00; B21C3/02; C25D7/06
Attorney, Agent or Firm:
Masanori Fujimaki
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