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Title:
EXTRUSION MOLDING METHOD
Document Type and Number:
Japanese Patent JPH0820062
Kind Code:
A
Abstract:

PURPOSE: To provide an extrusion molding method preventing the generation of die refuse in extrusion molding to obtain an extrusion molded article having beautiful surface appearance.

CONSTITUTION: A compound consisting of 100 pts.wt. of plastic or/and rubber and 50-300 pts.wt. of an additive composed of an insoluble substance is subjected to extrusion molding at extrusion temp. while a lubricant is injected into a die to be applied to the inner wall thereof or the die is heated to temp. higher than molding temp. by 10-20°C to subject the compound to extrusion molding or the compound is subjected to extrusion molding by combining the above mentioned methods. Therefore, the generation of die refuse is prevented and an extrusion molded article or an insulated electric wire having beautiful surface appearance is obtained. Further, the generation of the deficiency such as spark- out of the electric wire can be prevented. Furthermore, extrusion molding speed can be increased and the production efficiency of the extrusion molded article can be enhanced and the monitoring of die refuse in a production line can be made unnecessary.


Inventors:
OTA YUTAKA
KAIDE TAMOTSU
TAKAI TAKUMA
YAMAZAKI MOTOHIKO
Application Number:
JP15699594A
Publication Date:
January 23, 1996
Filing Date:
July 08, 1994
Export Citation:
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Assignee:
MITSUBISHI CABLE IND LTD
International Classes:
B29C47/86; B29C47/94; B29K21/00; (IPC1-7): B29C47/94; B29C47/86
Attorney, Agent or Firm:
Takashima Hajime



 
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