Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FABRICATION APPARATUS AND FABRICATION METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2009071122
Kind Code:
A
Abstract:

To provide a fabrication apparatus and fabrication method of a semiconductor device that allow the temperature distribution of a substrate to be rendered uniform.

The fabrication apparatus for the semiconductor device includes a susceptor 2 holding the substrate 1, a heater arranged at a back side of the susceptor 2, a support member 11 located between the substrate 1 and the susceptor 2, including a support portion 12, and a spacer 14 located between the susceptor 2 and the support member 11. An opening formed in the spacer 14 forms a gap 15 between the susceptor 2 and the support member 11, so the quantity of heat conducted from the susceptor 2 directly to the support portion 12 by heat conduction decreases. Consequently, heat transmission to an outer peripheral portion in contact with the support portion 12 of the substrate 1 decreases, so the generation of a temperature distribution on the substrate 1 resulting from a rise in temperature of the substrate 1 at the outer peripheral portion is suppressed to make the temperature distribution of the substrate 1 uniform.


Inventors:
UENO MASANORI
UEDA TOSHIO
WATANABE YOKO
Application Number:
JP2007239262A
Publication Date:
April 02, 2009
Filing Date:
September 14, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L21/205; C23C16/458; C23C16/46; H01L21/683; H01L33/32
Domestic Patent References:
JP2005513773A2005-05-12
JP2006173560A2006-06-29
JPH07249580A1995-09-26
JP2007173417A2007-07-05
JP2004055672A2004-02-19
JP2009502039A2009-01-22
JP2009534824A2009-09-24
JP2004327761A2004-11-18
JPS6242416A1987-02-24
JP2003086522A2003-03-20
JP2005513773A2005-05-12
JP2006173560A2006-06-29
JPH07249580A1995-09-26
JP2007173417A2007-07-05
JP2004055672A2004-02-19
JP2009502039A2009-01-22
JP2009534824A2009-09-24
JP2004327761A2004-11-18
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Nobuo Arakawa