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Patent Searching and Data


Title:
FABRICATION METHOD FOR WIRE COIL
Document Type and Number:
Japanese Patent JPH0597111
Kind Code:
A
Abstract:

PURPOSE: To keep the sliding between wires favorable to prevent the frictional damage between wires from happening, and make a wire coil more compact by consolidation by a method wherein a pickling process is applied to a wire, and after a film forming process of a lubricant has been applied on the surface of the wire, the wire is wound into a coil shape and tied.

CONSTITUTION: In order to fabricate a wire coil 14, a pickling process is applied to a metal wire, e.g. a martensite stainless steel wire 10, first, to remove scale. Then, a film forming process 12 of a lubricant is applied on the surface of the wire 10. Then, the wire 10 is tied by a tying material 15 to fabricate the wire coil 14. By this method, sliding between the wires 10 is kept favorable, and the generation of frictional damage due to the contact between the wires 10 is favorably suppressed, and the same time, the wire coil 14 is sufficiently tightly tied. Thus, constituted wire coil 14 can keep the height H lower compared with the height Ha of a conventional wire coil 14a, and the wire coil 14 can be compactly constituted.


Inventors:
ASAO YUTAKA
Application Number:
JP28561591A
Publication Date:
April 20, 1993
Filing Date:
October 05, 1991
Export Citation:
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Assignee:
DAIDO STEEL CO LTD
International Classes:
B21C47/00; B65B27/06; (IPC1-7): B21C47/00; B65B27/06
Attorney, Agent or Firm:
Kazuo Yoshida