To provide a facility for manufacturing a semiconductor capable of productively forming a film requiring repeated treatment process and effectively forming several other films.
A flow shop facility unit 20 having a plurality of processing facilities 21 conducting several treatment to form a predetermined film placed in line along a work transferring path 7 based on a treatment sequence is set and combined with a first job shop facility unit 2 having all of a whole process facility 6 and the work transferring path 7 kept in highly clean state, a second job shop facility unit 3 having a part of a process facility 8 and the work transferring path T kept in highly clean state, and a third job shop facility unit 4 having only the work transferring path 7 kept in highly clean state.
FUJITA MASAHITO
NISHIWAKI TORU
FUJIWARA KAZUO
MITSUI AKIRA
UEDA SEIJI
HAMA NOBORU
KAWADA SHINICHI
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