Title:
FAST-CURING EPOXY SYSTEMS
Document Type and Number:
Japanese Patent JP2020084192
Kind Code:
A
Abstract:
To provide: epoxy compositions that react much more quickly under the same conditions than the formulations known to date and have a low glass transition temperature Tg, and that partly or fully cure more quickly than is possible to date at temperatures well below room temperature; and processes for the production thereof, and the use thereof.SOLUTION: The compositions comprise at least one epoxy resin, at least one amine having at least two secondary amino groups that are both part of an organic ring system, and at least one alkyl alcohol optionally substituted with at least one aromatic group and/or with at least one alkenyl group.SELECTED DRAWING: None
Inventors:
SPYROU EMMANOUIL DR
DIRK FUCHSMANN
BRITTA KOHLSTRUK
ANNETTE SANDKUEHLER
DIRK FUCHSMANN
BRITTA KOHLSTRUK
ANNETTE SANDKUEHLER
Application Number:
JP2019216874A
Publication Date:
June 04, 2020
Filing Date:
November 29, 2019
Export Citation:
Assignee:
EVONIK OPERATIONS GMBH
International Classes:
C08G59/50; C09D7/20; C09D163/00; C09J163/00
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima