Title:
RELAY BOARD WITHOUT FEATURE LAYER STRUCTURE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2021197551
Kind Code:
A
Abstract:
To provide a relay board without a feature layer structure and a manufacturing method of the same.SOLUTION: A relay board 200 includes an insulating layer 204 and a through-hole pillar layer embedded in the insulating layer. The relay board 200 has no feature layer structure, and an edge of a through-hole pillar 206 is used as a pad. A manufacturing method of the same includes the steps of preparing a temporary support plate, making a border on the temporary support plate, laminating an insulating material on upper and lower surfaces of the temporary support plate to form an insulating layer, making through-holes in the insulating layer, filling the through-holes with a metal, removing the border, and removing the temporary support plate.SELECTED DRAWING: Figure 4
Inventors:
CHEN XIANMING
GU MIN
HUANG BENXIA
FENG LEI
XIE BINGSEN
GU MIN
HUANG BENXIA
FENG LEI
XIE BINGSEN
Application Number:
JP2021096349A
Publication Date:
December 27, 2021
Filing Date:
June 09, 2021
Export Citation:
Assignee:
ZHUHAI ACCESS SEMICONDUCTOR CO LTD
International Classes:
H05K3/40; H05K1/11; H05K3/00
Domestic Patent References:
| JP2000188478A | 2000-07-04 | |||
| JP2005244163A | 2005-09-08 | |||
| JP2017085046A | 2017-05-18 | |||
| JP2007335698A | 2007-12-27 | |||
| JP2009032918A | 2009-02-12 | |||
| JP2011129563A | 2011-06-30 | |||
| JP2014146761A | 2014-08-14 | |||
| JP2014150250A | 2014-08-21 |
Foreign References:
| CN103681559A | 2014-03-26 |
Attorney, Agent or Firm:
Takashi Shoji
Yuriko Shinobu
Takuya Osugi
Hirata Midori
Shoji Akira
Yuriko Shinobu
Takuya Osugi
Hirata Midori
Shoji Akira