Title:
FEEDER ELECTRODE FOR PLATING DEVICE AND PLATING DEVICE
Document Type and Number:
Japanese Patent JPH0320499
Kind Code:
A
Abstract:
PURPOSE:To obtain a uniform plating by coating the entire surface of a reticular substrate with platinum to form the feeder electrode for the device for plating an IC lead frame, etc. CONSTITUTION:The feeder electrode 11 is formed by coating the entire reticular surface of the titanium substrate 20 with platinum 21. The platinum 21 is deposited on the substrate 20 by plating. The electrode is used for the upper and lower electrodes 11 and 12 which are placed respectively in the upper and lower cells 4 and 5. When the lead frame 1 is placed on a lower mask 3 at its specified position, a press ram 7 is lowered, and the frame is clamped between the upper and lower masks 2 and 3. A plating soln. sent under pressure by a pump 10 is passed through the cell 5 from a pressure tank 8, introduced to the area hole 3a of the mask 3 and injected onto the exposed frame 1. The plating soln. leaving the frame 1 is passed through the upper area hole 2a and the cell 4 and discharged from an outlet 4a.
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Inventors:
TSUJITA YASUKI
Application Number:
JP15334889A
Publication Date:
January 29, 1991
Filing Date:
June 15, 1989
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C25D17/10; (IPC1-7): C25D17/10
Attorney, Agent or Firm:
Shigetaka Awano (1 person outside)