Title:
FEEDING APPARATUS AND SEMICONDUCTOR MANUFACTURING EQUIPMENT HAVING THE SAME
Document Type and Number:
Japanese Patent JP3814267
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a feeding apparatus including a feeding antenna which can flatten the electromagnetic energy absorption distribution of plasma in the radial direction and generate homogeneous electric and magnetic fields even when it has a plurality of coils.
SOLUTION: The feeding apparatus is provided with a feeding antenna I which consists of a plurality of arc-shaped coils and generates plasma, and a matching circuit III having capacitors that are connected in parallel to respective coils of this feeding antenna I. The matching circuit III has cylindrical capacitors 2 and 3 having electrodes on both ends in axial direction, primary to third electrodes 4, 5 and 6 which are assured mutual insulation and placed in parallel. The feeding apparatus is constituted so that one electrode of capacitor 2 and the primary electrode 4, one electrode of the capacitor 3 and the second electrode 5, and the other electrodes of capacitors 2, 3 and the third electrode 6 are respectively connected.
Inventors:
Ryuichi Matsuda
Noriteru Ueda
Kazuto Yoshida
Noriteru Ueda
Kazuto Yoshida
Application Number:
JP2003322916A
Publication Date:
August 23, 2006
Filing Date:
September 16, 2003
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES,LTD.
International Classes:
H01L21/31; H05H1/46; C23C16/509; (IPC1-7): H01L21/31; C23C16/509; H05H1/46
Domestic Patent References:
| JP11354511A | ||||
| JP8078191A | ||||
| JP2002519861A | ||||
| JP2002502547A |
Attorney, Agent or Firm:
Toshiro Mitsuishi
Tadahiro Mitsuishi
Yasuyuki Tanaka
Tadahiro Mitsuishi
Yasuyuki Tanaka
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