Title:
FEEDING CONTAINER FOR ELECTRONIC COMPONENT AND METHOD AND APPARATUS FOR FEEDING ELECTRONIC COMPONENT USING IT
Document Type and Number:
Japanese Patent JP3409571
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent danger of breakage of an electronic component from occurring during transferring and to provide such a structure that does not decrease the rate of operation and to realize effective method and apparatus for feeding the electronic component by using this feeding container.
SOLUTION: Four fitting holes 22 are formed on the first frame 20 being a synthetic resin molded article and constituted into a flat square shape and in each of these fitting holes 22, an inserting part 22a with a larger forming width and a fixing part 22b connected with this inserting part 22a and with a smaller forming width are integrally formed. A pressure-sensitive adhesive sheet 10 wherein a pressure-sensitive adhesive layer is formed on a base sheet is provided. Four semi-spherical through-holes 32 corresponding to the fitting holes 22 of the first frame 20 are formed on the second frame 30. Hooking projections 33 each with a shaft part with a semi-spherical crosssection are respectively provided from the side face of the inside of each of the through- holes 32 so as to be projected upward.
Inventors:
Shinichi Nakamura
Application Number:
JP7372996A
Publication Date:
May 26, 2003
Filing Date:
March 28, 1996
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B65D73/02; B65D85/86; H05K13/02; (IPC1-7): B65D85/86; B65D73/02; H05K13/02
Domestic Patent References:
| JP5193684A | ||||
| JP697214A |
Attorney, Agent or Firm:
Masataka Ueyanagi