Title:
FERROELECTRIC THIN FILM LAMINATE SUBSTRATE, FERROELECTRIC THIN FILM ELEMENT AND MANUFACTURING METHOD FOR FERROELECTRIC THIN FILM LAMINATE SUBSTRATE
Document Type and Number:
Japanese Patent JP2016184688
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a niobate acid type ferroelectric thin film laminate substrate that enables higher adhesion strength as compared with the prior art when wire bonding is applied to a thin film element, and a ferroelectric thin film element cut out from the laminate substrate.SOLUTION: A ferroelectric thin film laminate substrate includes a lower electrode layer, a ferroelectric thin film layer, an upper electrode adhesion layer, and an upper electrode layer which are sequentially laminated on a substrate. The lower electrode layer is made of Pt or Pt alloy, the ferroelectric thin film layer consists of (KNa)NbO(0.4≤x≤0.7), the upper electrode layer is made of Au, and the upper electrode adhesion layer is made of a metal which is more hardly oxidizable than Ti and capable of becoming solid solution alloy without forming any intermetallic compound with Au. A part of the upper electrode adhesion layer and a part of the upper electrode layer are alloyed.SELECTED DRAWING: Figure 2
Inventors:
HORIKIRI FUMIMASA
SHIBATA KENJI
WATANABE KAZUTOSHI
NOGUCHI MASAKI
SUENAGA KAZUFUMI
SHIBATA KENJI
WATANABE KAZUTOSHI
NOGUCHI MASAKI
SUENAGA KAZUFUMI
Application Number:
JP2015064726A
Publication Date:
October 20, 2016
Filing Date:
March 26, 2015
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
H01L41/047; H01L21/8246; H01L27/105; H01L37/02; H01L41/187; H01L41/29
Domestic Patent References:
| JP2015053417A | 2015-03-19 | |||
| JP2010161330A | 2010-07-22 | |||
| JP2011192736A | 2011-09-29 |
Foreign References:
| US20050082584A1 | 2005-04-21 |
Attorney, Agent or Firm:
Polaire Patent Business Corporation