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Patent Searching and Data


Title:
FERRULE PROCESSING WIRE
Document Type and Number:
Japanese Patent JP2005288606
Kind Code:
A
Abstract:

To provide a ferrule processing wire to grind the inside surface of a ferrule capable of performing the processing easily without degrading the working environment and also assuring a high processing accuracy.

An abrasive grain layer 13 is formed by plating on the outside surface of the body 12 of a processing wire 11 and is furnished with a tapered abrasive grain layer 13a, a first equal size abrasive grain layer 13b continued to the major diametric portion of the tapered abrasive grain layer 13a, and a second equal size abrasive grain layer 13d having the same diameter as the first 13b while a minor diametric portion 13c is interposed. The processing wire 11 is threaded to the inside surface of the ferrule, and the ferrule is put in relative movement from the side with the tapered abrasive grain layer 13a toward the first 13b and second equal size abrasive grain layers 13d.


Inventors:
TAKAKU MITSUO
TSUKADA KEISUKE
TANI YASUHIRO
Application Number:
JP2004105803A
Publication Date:
October 20, 2005
Filing Date:
March 31, 2004
Export Citation:
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Assignee:
NIPPEI TOYAMA CORP
TANI YASUHIRO
International Classes:
B24D11/00; B24D3/06; (IPC1-7): B24D11/00; B24D3/06
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda