Title:
FIBER-REINFORCED INORGANIC BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3165797
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the occurrence of a warpage as a recess on the surface side after the execution of a fiber-reinforced inorganic board.
SOLUTION: The fiber-reinforced inorganic board 4 consists of inorganic hardening phase and a fibrous substance disposed into the inorganic hardening phase. The net percentage by weight of the inorganic hardening phase of an uppermost layer section 4A having the thickness of 1/20-1/10 of overall thickness from a surface is represented by (x) (weight %) and the net percentage by weight of the inorganic hardening phase of a lowermost layer section 4B having the thickness of 1/20-1/10 of overall thickness from a rear by (y) (weight %), and the inorganic board 4 is manufactured so as to satisfy x+0.05x≤y≤x+0.25x at that time, the stretchability of the uppermost layer section 4A and the lowermost layer section 4B is made to differ, and a warpage formed in a projecting shape to the surface side after execution is generated.
Inventors:
Kasho Kazuo
Application Number:
JP28437197A
Publication Date:
May 14, 2001
Filing Date:
September 30, 1997
Export Citation:
Assignee:
Nichiha Co., Ltd.
International Classes:
E04D1/16; B28B1/52; (IPC1-7): B28B1/52
Domestic Patent References:
| JP661893B2 |
Attorney, Agent or Firm:
Tadao Usami