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Title:
FIBER SUBSTRATE FOR COMPOSITE MATERIAL
Document Type and Number:
Japanese Patent JP2004060058
Kind Code:
A
Abstract:

To enhance interlaminar strength (peel strength, out-of-plane strength and strength after impact), raise the impregnation efficiency of a matrix during the compositing and further eliminate resin-rich parts to be weak points in strength in a fiber substrate for composite materials.

A single substrate 4 knitted or woven from filaments and having a three-dimensional shape is used or the plurality of substrates 4 are superimposed to raise strength between layers or in joint surfaces. Permeability of the matrix is promoted near the surface and in the interior and a treatment of raising 5 is carried out in order to raise the smoothness of the surface. The treatment of raising is performed even on the fiber substrate for the composite materials prepared by superimposing a plurality of sheetlike substrates knitted or woven from the filaments or superimposing the plurality of the sheetlike substrates and substrates having the three-dimensional shape. The treatment of raising is carried out by needle punching. A fiber web, as necessary, is inserted between fiber constructions simultaneously with the treatment of raising. Thereby, the surface of the fiber substrate is subjected to a smoothing treatment.


Inventors:
Abe, Toshio
Nishiyama, Shigeru
Shinya, Masahiro
Fukuoka, Toshiyasu
Ishibashi, Masayasu
Hashimoto, Koichi
Tanamura, Takeshi
Sakonjiyou, Hideki
Hirokawa, Tetsuro
Application Number:
JP2002000215357
Publication Date:
February 26, 2004
Filing Date:
July 24, 2002
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
SHIKIBO LTD
International Classes:
D06C11/00; B32B5/02; D03D25/00; D04H1/498; (IPC1-7): D04H1/46; B32B5/02; D06C11/00
Attorney, Agent or Firm:
江原 省吾
田中 秀佳
白石 吉之
城村 邦彦
熊野 剛
山根 広昭