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Title:
充填成形装置及び充填成形方法
Document Type and Number:
Japanese Patent JP5635795
Kind Code:
B2
Inventors:
山田 芳也
桃井 俊生
Application Number:
JP2010091796A
Publication Date:
December 03, 2014
Filing Date:
April 12, 2010
Export Citation:
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Assignee:
株式会社小松ライト製作所
International Classes:
B29C45/20; B22D17/20; B29C45/46
Attorney, Agent or Firm:
Yasuo Itaya
Katsumi Taguchi
Shinichi Mizuta
浦 Juko



 
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