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Title:
FILLED RESIN MOLDING CONTAINING FILLER
Document Type and Number:
Japanese Patent JP2000256473
Kind Code:
A
Abstract:

To obtain a filled resin molding containing a filler, having improved surface properties and prevented in deterioration in toughness by making a filler in a molding distributed in such a manner that the concentration of the filler, which has a specific gravity higher than that of the resin, is higher in the surface region that in the inner region.

A composition containing a monomer or an oligomer, 1-50 wt.%, particularly, 5-30 wt.% filler having a specific gravity higher than that of the resin to be formed, and optionally, a catalyst and a polymerization initiator is poured into a rotating mold and polymerized to a viscosity of 1-1,000 Pa.s, particularly, 10-100 Pa.s while it is centrifugally pushed against the inner wall of the mold to form a surface region having a thickness of 1-50 mm. Next, a composition containing a filler in such an amount that the ratio of the filler content of the surface region to that of the inner region is 10/9 to 10/0, a monomer or an oligomer, and, optionally, a catalyst and a polymerization initiator is poured into a mold and polymerized to obtain a molding in which the concentration of the filler having a specific gravity higher than that of the resin is higher in the surface region than in the inner region.


Inventors:
HOSHIKAWA ATSUSHI
ASANO JUNJI
Application Number:
JP6425399A
Publication Date:
September 19, 2000
Filing Date:
March 11, 1999
Export Citation:
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Assignee:
NIPPON POLYPENCO LTD
International Classes:
B29C70/58; B29C41/04; C08J5/00; C08K3/00; C08K3/04; C08L77/02; C08L101/00; C08L101/16; (IPC1-7): C08J5/00; B29C41/04; B29C70/58; C08K3/00; C08K3/04; C08L77/02; C08L101/16
Attorney, Agent or Firm:
Mitsuo Matsui