Title:
FILLER FOR COOLING DEVICE AND COOLING DEVICE
Document Type and Number:
Japanese Patent JP2014152942
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a filler which improves the cooling efficiency of a cooling device, and to provide the cooling device including the filler.SOLUTION: A filler 22 for a cooling device is installed in a cooling device 100 to be used for conducting heat exchange between a heat medium flowing on a surface and air and has a heat exchange part 28 along which the heat medium flows. A surface of the heat exchange part has a shape formed by combining multiple wavy surfaces. The multiple wavy surfaces include large wavy surfaces 34 and small wavy surfaces 42 combined on each large wavy surface. A pitch p1 of the large wavy surface is larger than a pitch p2 of the small wavy surface, and the amplitude h1 of the large wavy surface is larger than the amplitude h2 of the small wavy surface.
Inventors:
SANNOMIYA KAZUHIKO
KUDO KEIICHI
KUDO KEIICHI
Application Number:
JP2013020405A
Publication Date:
August 25, 2014
Filing Date:
February 05, 2013
Export Citation:
Assignee:
MITSUBISHI PLASTICS INC
International Classes:
F28F25/08; F28C1/04
Domestic Patent References:
| JPS55133223U | 1980-09-20 | |||
| JPS4825349B1 | 1973-07-27 | |||
| JP3061686U | 1999-09-24 | |||
| JP2000180074A | 2000-06-30 |
Foreign References:
| US3415502A | 1968-12-10 | |||
| US4512938A | 1985-04-23 |
Attorney, Agent or Firm:
Yamamoto 典輝
Akihiko Yamashita
Kishimoto Expert
Akihiko Yamashita
Kishimoto Expert
Previous Patent: INSTALLATION METHOD OF UNDERGROUND HEAT EXCHANGER AND INSTALLATION APPARATUS OF UNDERGROUND HEAT EXC...
Next Patent: AIR CONDITIONER
Next Patent: AIR CONDITIONER