Title:
充填方法及びその装置
Document Type and Number:
Japanese Patent JP4641576
Kind Code:
B2
Inventors:
Hiroshi Nagata
Masato Sagawa
Toshihiro Watanabe
Masato Sagawa
Toshihiro Watanabe
Application Number:
JP25276699A
Publication Date:
March 02, 2011
Filing Date:
September 07, 1999
Export Citation:
Assignee:
Intermetallics Co., Ltd.
International Classes:
B65B1/16; B65B1/26; B65B63/02
Domestic Patent References:
| JP9169301A | ||||
| JP1149101A |
Attorney, Agent or Firm:
Kyoto International Patent Office