Title:
充填構造体
Document Type and Number:
Japanese Patent JP4467040
Kind Code:
B2
Abstract:
A filling structure 10 is a structure in which a filling material 12 having a higher impact energy absorbing performance is inserted into the inner part of a hollow member 11, and the filling material 12 so inserted is fixed to the hollow member 11 with an adhesive layer 13 resulting when the filling material 12 is heated to expand and is cooled to set thereafter.
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Inventors:
Ryoichi Ishikawa
Mitsuhiko Ueki
Katsuhiro Shibata
Mitsuhiko Ueki
Katsuhiro Shibata
Application Number:
JP2003322053A
Publication Date:
May 26, 2010
Filing Date:
September 12, 2003
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B62D25/04; B60R19/18; F16F7/00; B60R19/22; B62D21/15; B62D29/00; C09J5/08; F16F7/12; C08L63/00; C08L75/04
Domestic Patent References:
| JP2000079856A | ||||
| JP11099531A | ||||
| JP48000744A | ||||
| JP58038758U |
Attorney, Agent or Firm:
Yoichiro Shimoda