To provide a film adhesive for circuit connection, which can decrease the heating temperature and the pressing force in a temporary connection process and can improve the workability.
A heat-adherent film adhesive for circuit connection is used to electrically connect circuit electrodes facing each other in the pressing direction by heating and pressing the circuit electrodes, and contains an epoxy resin, a potential curing agent, and a phenoxy resin having a molecular weight of 20,000 or more. One side of the film adhesive is supported by a separator. There is a difference in peel force before heat curing between the sides of the film adhesive. The peel force (A) for the separator (supporter) side is smaller than the peel force (B) for the other side. The blending quantity of the phenoxy resin having a molecular weight of 20,000 or more into the mixture of the epoxy resin and the potential curing agent is greater in the adhesive constituting the separator side than in the adhesive constituting the other side.
WATANABE ITSUO
TAKEMURA KENZO
WATANABE OSAMU
ISAKA KAZUHIRO
KOJIMA KAZUYOSHI
| JPH03105932A | 1991-05-02 | |||
| JPH08250543A | 1996-09-27 | |||
| JPH08337763A | 1996-12-24 | |||
| JPH0517725A | 1993-01-26 | |||
| JPH0737432A | 1995-02-07 | |||
| JPH11106714A | 1999-04-20 |
| WO1996042107A1 | 1996-12-27 |
Yoshinori Shimizu