Title:
FILM FOR ADHESIVE MATERIAL TO BE USED BY ADHERING TO OBJECT TO BE SUBJECTED TO BENDING DEFORMATION
Document Type and Number:
Japanese Patent JP2013169322
Kind Code:
A
Abstract:
To provide a film for an adhesive material which is hardly peeled off by following to the bending deformation when an object to which the film adheres is subjected to the bending deformation after adhering; and to provide an adhesive material formed by using this film.
A film for an adhesive material has ≤3N/25 mm of tensile load of 20%, 0.2-15 MPa of elastic modulus, 0.1-25 GPa s of viscosity and ≤15°C of glass transition temperature. The film is used by adhering to an object to be subjected to bending deformation.
Inventors:
YAMAMOTO TOSHIYUKI
KUBOTA DAISUKE
YANO MASAHIKO
UKO MANABU
HIRAO KOICHI
NASU KIICHI
KUBOTA DAISUKE
YANO MASAHIKO
UKO MANABU
HIRAO KOICHI
NASU KIICHI
Application Number:
JP2012034840A
Publication Date:
September 02, 2013
Filing Date:
February 21, 2012
Export Citation:
Assignee:
TOYO KAGAKU KK
SHIGA PREFECTURE
SHIGA PREFECTURE
International Classes:
A61F13/02; C09J7/02
Domestic Patent References:
| JP2007135673A | 2007-06-07 | |||
| JP2001163771A | 2001-06-19 | |||
| JP2003010306A | 2003-01-14 | |||
| JP2003335873A | 2003-11-28 | |||
| JP2006230930A | 2006-09-07 |
Attorney, Agent or Firm:
Takayoshi Kusumoto
Takanobu Nakaetsu
Takanobu Nakaetsu