Title:
フィルムコンデンサ
Document Type and Number:
Japanese Patent JP6616692
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the heat receiving suppression performance of a film capacitor to a capacitor element significantly, while down-sizing.SOLUTION: Between a capacitor case 3 and a heat generator (heating element) 5 near the outside thereof, a radiation heat conduction suppression film 7 is interposed in addition to a space 6 for contact heat transmission prevention. The radiation heat conduction suppression film 7 is formed by coating the inside of an overflow prevention dam 3b on the outer periphery of a case upper-side plate 3a with a paint mixed with metal particles. A circuit board 4 is placed on multiple hubs 3d formed on the upper surface of the overflow prevention dam 3b and fixed thereto. The heat generator 5 on the circuit board 4 faces the case upper-side plate 3a, and the space 6 for contact heat transmission prevention is provided between the circuit board 4 and heat generator 5 and the radiation heat conduction suppression film 7.SELECTED DRAWING: Figure 2
Inventors:
High Kaki Koji
Application Number:
JP2016008825A
Publication Date:
December 04, 2019
Filing Date:
January 20, 2016
Export Citation:
Assignee:
Nichicon Co., Ltd.
International Classes:
H01G4/224; H01G2/08; H01G4/32; H01G4/40
Domestic Patent References:
| JP2008187206A | ||||
| JP2011031601A | ||||
| JP2013033776A | ||||
| JP2010192653A | ||||
| JP62189790A |
Attorney, Agent or Firm:
Kazuhide Okada