To produce a film carrier having high through-hole reliability by providing conductive parts formed by burying conductive wires in through-holes.

Wires 4 are bonded to through-holes 3 of 50μm diameter formed by an excimer laser through a polyimide film 1 75μm thick. After feeding the wire 4, without cutting it, it is bonded again to each hole 3 and cut to form a conductive part 3a. Cu is vapor-deposited to form a Cu layer 2 (upper surface 1). After cutting the wire and fed, the second bonding may be applied to the upper surface Cu layer, without twice bonding at the same hole. Thereafter the wire is cut. Thus it is possible to obtain a film carrier having a high through-hole reliability at low cost in a simple process.