Title:
FILM CARRIER TAPE FOR COF
Document Type and Number:
Japanese Patent JP3687658
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve such a problem that a COF tape is adhered to a heating tool, resulting in a joint failure of a lead and a bump because the heating tool is heated at a high temperature in conventional COF bonding.
SOLUTION: The film carrier tape for COF used for COF bonding is formed by forming an optional wiring pattern on a tape-like insulation film and heating/press-fitting a lead with the wiring pattern to a bump formed on a semiconductor chip with the insulation film in between at a specified temperature by using a heating tool. A backing film having a dynamic elastic modulus of 10.0 GPa or more at 300-400°C of the heating tool is joined with a rear surface of the insulation film.
Inventors:
Katsumi Suzuki
Kenji Yamaguchi
Kenji Yamaguchi
Application Number:
JP2003097024A
Publication Date:
August 24, 2005
Filing Date:
March 31, 2003
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2002231769A | ||||
| JP2001210676A | ||||
| JP2004207550A |
Attorney, Agent or Firm:
Tadao Hirata