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Patent Searching and Data


Title:
FILM CARRIER TAPE, SEMICONDUCTOR DEVICE, AND PACKAGING OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0449633
Kind Code:
A
Abstract:

PURPOSE: To enable production yield to be enhanced in the packaging process and reliability to be improved without causing outer leads to stop to be parallel each other by providing a cut-out part at a region which is close to the in side of a region to be bonded by using a metal brazing material when performing packaging.

CONSTITUTION: A plastic film such as polyimide, epoxy resin with glass, BT resin, and polyester material is formed by using a punching press, etc. A copper film 2, etc., is thermocompressed to a plastic film 1 by using an adhesive. A photoresist film is formed and an etching mask 5 is formed by using the photolithography method. A copper film is dissolved and eliminated from a region which is not covered with the etching mask 5, thus forming the metal film 2. Then, a cut-out 23 is formed in a region of the metal film 2 where an outer lead is cut late by using the forming press, etc., or the photolithograthy method.


Inventors:
SHIBATA YUKIO
Application Number:
JP15872290A
Publication Date:
February 19, 1992
Filing Date:
June 19, 1990
Export Citation:
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Assignee:
FANUC LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Seiichi Samukawa