Title:
フィルム切断装置、及びフィルム切断方法
Document Type and Number:
Japanese Patent JP6663707
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a film cutting device which can cut a resin film as a material of a product without affecting safety and productivity of the product.SOLUTION: A film cutting device is provided with: a heating device which heats a part to be cut of a resin film so as to set a temperature of the part to be cut lower than a melting temperature of the resin film and higher than a softening temperature of the resin film; a support member including a planar support area for supporting the part to be cut; a cutting member having a projection strip part opposite to the support area; and a pressure device which presses the support area and the projection strip part with each other with the part to be cut interposed therebetween. A tip end part of the projection strip part is formed in a non-sharp cross sectional shape when viewed from a direction orthogonal to a first direction.SELECTED DRAWING: Figure 1
Inventors:
Yuuki Mori
Katsuhiro Takeuchi
Masami Sugino
Yoshifumi Fujimoto
Katsuhiro Takeuchi
Masami Sugino
Yoshifumi Fujimoto
Application Number:
JP2015250992A
Publication Date:
March 13, 2020
Filing Date:
December 24, 2015
Export Citation:
Assignee:
OTSUKA PHARMACEUTICAL FACTORY,INC.
International Classes:
B26F3/04; B26D7/10
Domestic Patent References:
| JP548674A | ||||
| JP2014226729A | ||||
| JP2003025287A | ||||
| JP2015182202A | ||||
| JP62130895U | ||||
| JP2006306445A |
Foreign References:
| CN203622567U | ||||
| US4860621 |
Attorney, Agent or Firm:
Noboru Fujimoto
Hiroaki Nakatani
Hiroaki Nakatani