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Title:
FILM DEPOSITION APPARATUS AND FILM DEPOSITION METHOD
Document Type and Number:
Japanese Patent JP2010163637
Kind Code:
A
Abstract:

To provide a film deposition apparatus capable of moving a vapor deposition head for blowing a film deposition material of an object to be processed between the film deposition position and the storage position.

A six-layer continuous film deposition apparatus 10 comprises: a plurality of vapor deposition sources 155 with a film deposition material stored therein; a plurality of connection pipes 150 which are connected to the plurality of vapor deposition sources 155 to convey the film deposition material vaporized by the vapor deposition sources 155; a plurality of vapor deposition heads 125 which are connected to the plurality of connection pipes 150 respectively and arranged in the height direction while being separated from one another; and a processing chamber 100 for continuously executing the film deposition of the object to be processed therein with the film deposition material blown from the plurality of vapor deposition heads 125. The plurality of vapor deposition heads 125 are moved between the storage position and the film deposition position for blowing the film deposition material conveyed through the plurality of connection pipes 150 toward a substrate G.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
ABE ETSUMI
SUSA TAMAO
Application Number:
JP2009004878A
Publication Date:
July 29, 2010
Filing Date:
January 13, 2009
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
C23C14/24; H01L51/50; H05B33/10
Domestic Patent References:
JP2004327272A2004-11-18
JP2004055401A2004-02-19
JP2008150649A2008-07-03
JP2004146369A2004-05-20
Attorney, Agent or Firm:
Miaki Kametani
Tetsuo Kanamoto
Koji Hagiwara