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Title:
FILM DEPOSITION APPARATUS AND SUBSTRATE HOLDER
Document Type and Number:
Japanese Patent JP2014077161
Kind Code:
A
Abstract:

To provide a film deposition apparatus and a substrate holder in which good film deposition processing can be implemented on both surfaces of substrates-under-processing held by the substrate holder.

A substrate holder 11 comprises openings 22 which exposes surfaces of substrates-under-processing S at a bottom section of a concavity 21 housing the substrates-under-processing S, and supporting sections 23 which support the substrates-under-processing S by contacting outer peripheral edges of the substrates-under-processing S. Outer surfaces of the supporting sections 23 are constructed so that their tip sides are slant planes 24 slanting towards the substrates-under-processing S. The substrates-under-processing S are carried to a processing section 50 while being held in the substrate holder 11, and film deposition processing on both surfaces of the substrates-under-processing S is implemented.


Inventors:
HASEGAWA TAKEYUKI
NAGASAWA SHOJI
OTOMO MASAHIKO
MATSUMOTO TAKESHI
KATAGIRI HIROAKI
OTA ATSUSHI
WATAI MIWA
Application Number:
JP2012224451A
Publication Date:
May 01, 2014
Filing Date:
October 09, 2012
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
C23C14/34
Domestic Patent References:
JPH08213442A1996-08-20
JP2000119841A2000-04-25
Foreign References:
WO1998052083A11998-11-19
Attorney, Agent or Firm:
Hiroyuki Kurihara
Muranaka