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Patent Searching and Data


Title:
FILM DEPOSITION METHOD AND FILM-DEPOSITED SUBSTRATE
Document Type and Number:
Japanese Patent JP2007297251
Kind Code:
A
Abstract:

To provide a film deposition method where the number of procedures can be reduced by easily controlling substrate temperature in an HVPE film growing method and to provide a film-deposited substrate.

The film deposition method comprises a step to support the substrate 16 on a substrate holding part 10 in a treating chamber 110, a heating step to heat the outer periphery 16a of the substrate 16 to be higher in temperature than that of the central portion 16b of the substrate 16 with a heating member 20 located under the substrate 16 and a film deposition step to grow a film on the substrate 16 by the HVPE method. The heating member 20 has a plurality of heaters 14a, 14b and 14c by which temperature can be independently controlled. It is favorable that the temperature of the substrate 16 is controlled by a plurality of heaters 14a, 14b and 14c.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
NISHIOKA SHIKO
KAMIMURA TOMOYOSHI
FUJIWARA SHINSUKE
Application Number:
JP2006128423A
Publication Date:
November 15, 2007
Filing Date:
May 02, 2006
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C30B25/10; C23C16/34; C23C16/46; C30B29/38; H01L21/205
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai