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Patent Searching and Data


Title:
FILM DEPOSITION METHOD AND FILM DEPOSITION DEVICE PRACTICING THE SAME
Document Type and Number:
Japanese Patent JP2007162093
Kind Code:
A
Abstract:

To improve the mass-productivity of a cathode used for a field emission type lamp.

A cylindrical body 14 is arranged at the inside of a chamber 12 under ordinary pressure. A conductor wire 28 (the substrate to be film-deposited) is arranged at the inside of the cylindrical body 14. A first d.c. negative bias is applied to the conductor wire 28, and also, the cylindrical body 14 is made into a floating state. A hydrocarbon gas and an oxygen-containing gas are introduced into the cylindrical body 14, and the hydrocarbon gas and the oxygen-containing gas are reacted at the inside of the cylindrical body 14, so as to generate combustion flame 38. A second d.c. negative bias is applied to the cylindrical body 14 during the generation of the combustion flame 38, thus d.c. plasma 40 is generated at the inside of the cylindrical body 14 with the combustion flame 38 as a plasma generation trigger. The hydrocarbon gas is decomposed by the d.c. plasma 40, and further, a carbon film 42 is deposited on the conductor wire 28 with the metal generated by sputtering to the cylindrical body as a catalyst metal.


Inventors:
KO MINAMI
O HIROOKI
HABA HOKI
Application Number:
JP2005361788A
Publication Date:
June 28, 2007
Filing Date:
December 15, 2005
Export Citation:
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Assignee:
DIALIGHT JAPAN CO LTD
International Classes:
C23C16/26; H01J9/02
Attorney, Agent or Firm:
Kazuhide Okada