Title:
FILM DEPOSITION METHOD
Document Type and Number:
Japanese Patent JP2005298929
Kind Code:
A
Abstract:
To provide a film deposition method capable of efficiently depositing a mixed film formed of a plurality of materials on a substrate.
The method where a mixed film obtained by mixing the components of a first target 5 and the components of a second target 4 is deposited on a substrate 2 includes: a sputtering stage where DC voltage or AC voltage is applied to the first target 5 essentially consisting of TiOx(0<x<2), and the components of the first target 5 are sputtered on the substrate 2; and a second sputtering stage where the second target 4 composed of the material having a refractive index different from that of the first target is sputtered on the substrate 2.
More Like This:
Inventors:
NITTA YOSHIKI
KAWAMATA TAKESHI
KAWAMATA TAKESHI
Application Number:
JP2004118953A
Publication Date:
October 27, 2005
Filing Date:
April 14, 2004
Export Citation:
Assignee:
OLYMPUS CORP
International Classes:
G02B5/28; C23C14/06; C23C14/34; (IPC1-7): C23C14/06; C23C14/34; G02B5/28
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Tadao Takashiba
Masatake Shiga
Masakazu Aoyama
Suzuki Mitsuyoshi
Tadao Takashiba