Title:
Film deposition system and film deposition method
Document Type and Number:
Japanese Patent JP5950866
Kind Code:
B2
Abstract:
The present invention is to provide a deposition device capable of coping with a size change of a substrate only by replacing a magnet unit and a target material. A deposition device (1) of the present invention is to perform deposition onto a surface of a substrate W to be conveyed by using an evaporation source (2) facing a front surface of the substrate (W), and the evaporation source (2) has a target material (7), a backing plate (8), a magnet unit (9), a cathode body (10), and a cooling water flow passage (12). The cooling water flow passage (12) is a space formed by separating the magnet unit (9) and the backing plate (8), and the cooling water can be distributed through this space. As the magnet unit (9), a short magnet unit can be arranged in correspondence with a narrow-width substrate having narrower width than that of the substrate (W), and as the target material (7), a short target material is arranged in correspondence with width of the arrange magnet unit (9).
Inventors:
Asuka Umeda
Hiroshi Tamagaki
Hiroshi Tamagaki
Application Number:
JP2013103269A
Publication Date:
July 13, 2016
Filing Date:
May 15, 2013
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
C23C14/35
Domestic Patent References:
| JP9125245A | ||||
| JP2003193227A | ||||
| JP2010132994A | ||||
| JP6093442A | ||||
| JP2001509209A | ||||
| JP2011117019A | ||||
| JP2013014803A |
Attorney, Agent or Firm:
Toshio Yasuda
Mikio Yasuda
Mikio Yasuda