Title:
FILM FORMATION APPARATUS AND FILM FORMATION METHOD
Document Type and Number:
Japanese Patent JP2013084831
Kind Code:
A
Abstract:
To reduce the footprint, shorten a length of a process line, and realizes the reduction of apparatus costs and the productivity improvement.
A film formation apparatus includes: coating processing means 6 which transports a processed substrate G in the horizontal direction, discharges a coating liquid from a nozzle having a discharging port elongated in the width direction of the substrate, and forms a coating film on the substrate; first heating process means 11 heating the substrate where the coating film is formed with a first heating temperature; and second heating process means 12 heating the substrate heated by the first heating process means with a second heating temperature higher than the first heating temperature.
Inventors:
SAKAI MITSUHIRO
KAWAGUCHI YOSHIHIRO
KAWAGUCHI YOSHIHIRO
Application Number:
JP2011224620A
Publication Date:
May 09, 2013
Filing Date:
October 12, 2011
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L31/04; H01L21/31
Attorney, Agent or Firm:
Kinoshita Shigeru