Title:
成膜方法
Document Type and Number:
Japanese Patent JP7064723
Kind Code:
B2
Abstract:
In a first aspect of a present inventive subject matter, a multilayer structure includes a base with a surface and an electrically-conductive metal oxide film that is positioned directly or via another layer on the base. At least a part of the surface of the base contains as a major component at least one selected from the group of copper, copper alloy, aluminum, aluminum alloy, magnesium, magnesium alloy, and stainless steel. The electrically-conductive metal oxide film is 30 nm or more in thickness. The multilayer structure is electrically-conductive and has a contact resistance that is 100 mΩcm2 or less.
Inventors:
Shingo Yagyu
Takuto Ikawa
Toshimi Hitora
Takuto Ikawa
Toshimi Hitora
Application Number:
JP2018065787A
Publication Date:
May 11, 2022
Filing Date:
March 29, 2018
Export Citation:
Assignee:
Flosfia Co., Ltd.
International Classes:
C23C18/12; B05D1/02; B05D3/02; B05D5/12; B05D7/14; B05D7/24; C23C16/448; H01B5/14; H01B13/00; H01M8/0254
Domestic Patent References:
| JP2017199535A | ||||
| JP2016020535A | ||||
| JP2007246337A | ||||
| JP2007048753A | ||||
| JP2007305564A |
Foreign References:
| WO2011151889A1 | ||||
| US5258204 |