To materialize improvement of material utilization efficiency and operation rate, and to prevent deterioration in film thickness uniformity caused by stains of an application nozzle.
A film forming apparatus 1 is disclosed including: a stage 2 having a placing face 2a on which a workpiece W to be coated is placed; a rotating mechanism 3 which rotates the stage 2 in a rotating direction along the placing face 2a; an application nozzle 4 which ejects a material and applies it onto the workpiece W on the stage 2; a moving mechanism 5 which relatively moves the stage 2 and the application nozzle 4 in a direction crossing the rotating direction along the placing face 2a; a control section 10 which, while rotating the stage 2 with the workpiece W placed thereon by means of the rotating mechanism 3, relatively moves the stage 2 and the application nozzle 4 by the moving mechanism 5 in the crossing direction along the placing face 2a and which controls application of the material onto the workpiece W on the stage 2 by the application nozzle 4; and a washing device 7 which washes the application nozzle 4.
OSHIRO KENICHI
TOKUMOTO TAKAO
KA SADAO
IWASAKI SOICHIRO
CHUGAI RO KOGYO KAISHA LTD
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Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu