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Patent Searching and Data


Title:
FILM-FORMING COMPOSITION, ELECTRICAL INSULATION FILM AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2008222992
Kind Code:
A
Abstract:

To provide a film-forming composition capable of giving a film which is low in relative dielectric constant, has high mechanical strength and is excellent in planarity, to provide an electrical insulation film produced by using the above composition, and to provide an electronic device having the above electrical insulation film.

The film-forming composition comprises a polymer prepared by polymerizing a compound of formula (I). The electrical insulation film produced by using the above composition and the electronic device having the above electrical insulation film are also provided, respectively. In the formula (I), X is a group containing a CC bond or C=C bond; Y is a substituent; m is an integer of 3-6; and n is an integer of 0-17.


Inventors:
Watanabe, Yasushi
Watanabe, Katsuyuki
Application Number:
JP2007000067912
Publication Date:
September 25, 2008
Filing Date:
March 16, 2007
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
C08F38/00; C08F32/08; C09D5/25; C09D123/18; C09D147/00; C09D149/00; H01L21/312
Attorney, Agent or Firm:
野口 恭弘
深海 明子