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Title:
FILM FORMING COMPOSITION, INSULATED FILM, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2009215352
Kind Code:
A
Abstract:

To provide a film forming composition (coating liquid) can form an insulated film with a low dielectric constant, the excellent mechanical strength and a good surface property, and an electronic device using the composition.

The film forming composition includes a polymer of a substituted styrene derivative represented by formula (1), (wherein R1 is a hydrogen atom, an alkyl group or an aryl group, R2 is a hydrogen atom, an alkyl group or an aryl group, R3 is an alkyl group, an aryl group, an alkoxy group, an acyloxy group, an aryloxy group, a hydroxy group, a carboxyl group, an alkoxy carbonyl group, an aryloxycarbonyl group, a trialkylsilyl group or a triarylsilyl group, in the case R3 is present by plurality, they may be either same or different, and they may be coupled with each other to form a ring structure, and n is an integer or 0-4).


Inventors:
IWATO KAORU
INABE HARUKI
Application Number:
JP2008057615A
Publication Date:
September 24, 2009
Filing Date:
March 07, 2008
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
C09D125/02; C08F12/22; C08F38/00; C09D4/00; C09D5/00; C09D7/12; C09D149/00; H01L21/312; H01L21/768; H01L23/522
Domestic Patent References:
JPH023047A1990-01-08
JP2005133060A2005-05-26
JP2000264954A2000-09-26
JPH10330431A1998-12-15
JP2007254551A2007-10-04
JP2007009048A2007-01-18
JP2006245117A2006-09-14
Attorney, Agent or Firm:
Yasuhiro Noguchi
Akiko Deep Sea