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Patent Searching and Data


Title:
FILM FORMING DEVICE, MANUFACTURING DEVICE, FILM FORMING METHOD AND THE FORMATION METHOD OF LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2008270187
Kind Code:
A
Abstract:

To reduce manufacturing cost of a light-emitting device having a layer containing an organic compound by increasing a utilization efficiency of a vapor deposition material and reduce a manufacturing time required for manufacturing the light-emitting device.

The interior of a film forming chamber is reduced in pressure and a conductive surface substrate is rapidly heated by flowing electric current to it, and a material layer on the conductive surface substrate is evaporated in a short time and vapor-deposited on a film forming substrate. Then, a heating area on the conductive surface substrate heated rapidly is made to be an equal size to the film forming substrate, and film formation on the film forming substrate is completed by one time heating.


Inventors:
IBE TAKAHIRO
IKEDA TOSHIO
Application Number:
JP2008073229A
Publication Date:
November 06, 2008
Filing Date:
March 21, 2008
Export Citation:
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Assignee:
SEMICONDUCTOR ENERGY LAB
International Classes:
H05B33/10; C23C14/24; C23C14/50; H01L51/50
Domestic Patent References:
JPH10245547A1998-09-14
JP2002302759A2002-10-18
JPH107405A1998-01-13
JPH10200140A1998-07-31