Title:
成膜装置及び成膜装置の制御方法
Document Type and Number:
Japanese Patent JP7064407
Kind Code:
B2
Abstract:
The present invention provides a technique capable of performing film formation control by more accurately and simply ascertaining the condition of a device. The film forming apparatus and the method of controlling the film forming apparatus according to the present invention perform film forming by rate control in which a heating control unit controls the amount of power supplied to a heating source such that the film forming rate acquired by an acquisition unit is maintained at a predetermined value. When the film formation rate acquired by the acquisition unit exceeds a predetermined threshold value, the film formation unit performs film formation by switching from rate control to power control in which the heating control unit supplies power to the heating source at an amount of power set independent of the film formation rate acquired by the acquisition unit, and performs power control in which the heating control unit supplies power to the heating source at an amount of power set independent of the amount of power set independent of the amount of power set independent of the amount of power set independent of the amount of power set independent of the amount of power set independent of the amount of power set independent of the film formation rate acquired by the acquisition unit. The state of the film forming apparatus is determined on the basis of the amount of variation in the resonant frequency of the crystal oscillator during a predetermined period when the rotation control unit varies the rotational speed of the rotating body so that the length of the period in the non-shielded state during the predetermined period varies.
Inventors:
Yujiro Soeda
Application Number:
JP2018162790A
Publication Date:
May 10, 2022
Filing Date:
August 31, 2018
Export Citation:
Assignee:
Canon Tokki Co., Ltd.
International Classes:
C23C14/24; C23C14/54
Domestic Patent References:
| JP2000008164A | ||||
| JP2006193811A | ||||
| JP10251844A | ||||
| JP11222670A | ||||
| JP7180055A | ||||
| JP2014055335A |
Foreign References:
| WO2016017108A1 | ||||
| US5665214 |
Attorney, Agent or Firm:
Hidewa Patent Office
Takeshi Niwa
Nakamura Go
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi
Takeshi Niwa
Nakamura Go
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi
Previous Patent: Filtration device
Next Patent: Composition, heat conductive sheet, device with heat conductive layer
Next Patent: Composition, heat conductive sheet, device with heat conductive layer