FILM DEPOSITION DEVICE, DEVICE FOR PRODUCING ELECTRONIC DEVICE, FILM DEPOSITION METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Japanese Patent JP2022059618

A

To provide a film deposition device that achieves film deposition with high precision, a device for producing an electronic device, a film deposition method, and a method for producing an electronic device.SOLUTION: A film deposition device deposits a film deposition material on a substrate having a plurality of unit film deposition regions through a mask having openings corresponding to the unit film deposition regions. The film deposition device has a vacuum vessel, substrate adsorption means that is provided in the vacuum vessel and has a substrate adsorption face for adsorbing the substrate, a mask support unit that is provided in the vacuum vessel and supports the mask, up-and-down means that moves the substrate adsorption means and the mask support unit in a first direction vertical to the substrate adsorption face, a position movement mechanism that moves at least one of the substrate adsorption means and mask support unit on a face parallel to the substrate adsorption face, and a control unit that performs the film deposition operation of depositing the film deposition material in order for each unit film deposition region, by the position movement mechanism, so that the mask openings correspond to the plurality of unit film deposition regions of the substrate.SELECTED DRAWING: Figure 3

MATSUMOTO EIICHI
UZAWA SHIGEYUKI

JP2022010786A

April 13, 2022

January 27, 2022

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CANON TOKKI CORP

C23C14/24; C23C14/04; H01L51/50; H05B33/10

JP7017619B2

2022-02-08

Hidewa Patent Office

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