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Patent Searching and Data


Title:
FILM FORMING METHOD
Document Type and Number:
Japanese Patent JPH10156272
Kind Code:
A
Abstract:

To reduce the dispersion of film thickness distribution and to make uniform film thickness by a method in which a glass substrate is made to be parallel to a support member, to be placed on the upper side of a weir formed on one side of a liquid storage apparatus, and to contact the application liquid surface of the storage apparatus, and a film is application-formed on the back of the substrate.

A plane glass substrate 10 in which a film is to be formed on the back is placed on the upper side of an application weir 3 slantingly at a prescribed inclination, contacted with the application liquid 5 of the weir 3, and fixed in the middle surface part by a suction cup 12 to balance appropriately with the front end surface part of the substrate 10. The substrate 10 is pulled up diagonally along a guide roll 11, which is also a support member, by a wire connected with the suction cup 12 and moved, and a coating film 14 is application-formed on the back of the substrate 10 while a liquid reservoir 13 is being formed by the relative transfer between the substrate 10 and the weir 3. In this way, the dispersion of the film thickness can be reduced to at most ±10% to obtain a uniform film efficiently.


Inventors:
ITO TOSHIAKI
TAKEUCHI NOBUYUKI
TSUBOUCHI KAZUO
Application Number:
JP31682496A
Publication Date:
June 16, 1998
Filing Date:
November 28, 1996
Export Citation:
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Assignee:
CENTRAL GLASS CO LTD
International Classes:
B60J1/00; B05C3/00; B05C3/18; B05D1/26; C03C17/00; C03C17/28; C03C17/30; C03C17/34; C23C18/02; (IPC1-7): B05D1/26; B60J1/00; C03C17/00; C03C17/28; C03C17/30; C03C17/34; C23C18/02
Attorney, Agent or Firm:
Kohei Ishimaru