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Patent Searching and Data


Title:
FILM FORMING SYSTEM AND FILM FORMING METHOD
Document Type and Number:
Japanese Patent JP2004008906
Kind Code:
A
Abstract:

To provide a film forming system and a film forming method by which the controllability of the thickness of the film of a film forming material is improved while suppressing the quantity of the film forming material to be used.

The film forming system is provided with a wafer holding means for holding a wafer W, a tilting means for tilting the wafer holding means, a tilt angle control means for controlling the tilt angle of the wafer holding means, a rotation means for rotating the wafer holding means as the wafer holding means is tilted and a means for controlling the number of revolution of the wafer holding means.


Inventors:
Kurita, Hideaki
Application Number:
JP2002000164915
Publication Date:
January 15, 2004
Filing Date:
June 05, 2002
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G03F7/16; B05C11/08; B05C11/10; B05C13/02; B05D1/40; B05D3/00; H01L21/027; (IPC1-7): B05C11/08; B05C11/10; B05C13/02; B05D1/40; B05D3/00; H01L21/027
Attorney, Agent or Firm:
上柳 雅誉
藤綱 英吉
須澤 修