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Title:
FILM FOR HEAT-SEALING
Document Type and Number:
Japanese Patent JP2001294677
Kind Code:
A
Abstract:

To prepare a film which is used for heat-sealing, has excellent low temperature sealing characteristics, thermal stability, weather resistance and chemical resistance, scarcely has the irregularity of sealing strength, and has good peeling touch.

This film for heat-sealing is characterized by comprising a thermoplastic resin composition containing an aromatic vinyl compound-olefin random copolymer in an amount of ≥20 wt.% and having a heat-sealing strength of 0.02 to 2 N per mm of sealing width under heat-sealing conditions comprising a heat-sealing temperature of 120°C, a heat-sealing pressure of 0.4 MPa and a heat-sealing time of 1 sec.


Inventors:
ISHII MASATOMO
SHIMIZU MIKIO
ODA TAKESHI
SUZUKI SHIGERU
ARAI TORU
Application Number:
JP2000113474A
Publication Date:
October 23, 2001
Filing Date:
April 14, 2000
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08J5/18; B32B7/02; B32B27/28; C08F4/64; C08F4/659; C08F4/6592; C08F210/00; C08F210/02; C08F212/02; C08F212/08; C08F232/04; C08L23/02; C08L23/06; C08L25/00; C08L45/00; C08L51/04; C08L53/00; (IPC1-7): C08J5/18; B32B7/02; B32B27/28; C08F4/64; C08F210/00; C08F210/02; C08F212/02; C08F212/08; C08F232/04; C08L23/02; C08L23/06; C08L25/00; C08L45/00; C08L51/04; C08L53/00
Domestic Patent References:
JPH0423844A1992-01-28
JPH041215A1992-01-06
Foreign References:
WO1999045980A11999-09-16